Cryogenic Probe Stages
Enabling scalable, flexible, and high-throughput testing of individual quantum chips or entire wafers at millikelvin (mK) temperatures.
Key features
- Enables scalable quantum chip testing
- Increases testing throughput in the most cost-efficient way
- Operation down to mK temperatures
- Easy integration into cryostats
- 150 or 200 mm wafer probing
- Integrated probe card interface
- Precise and flexible positioning (Tx, Ty, Tz, Rz)
- No power dissipation during probing
Product description
Unlock scalable quantum chip testing with the CPS150 and CPS200 Cryogenic Probe Stages. Designed to move substrates in ultra-low temperatures down to millikelvin levels, these cutting-edge probe stages significantly increase testing throughput in the most cost-efficient way.
Tailored for Extreme Environments
Built for cryogenic and ultra-high vacuum (UHV) environments, the CPS150 can operate down to millikelvin temperatures, while the CPS200 delivers precision testing at 4K. Their modular design seamlessly integrates into cryostats by minimizing system interfacing, resulting in minimal thermal leakage.
Maximized Throughput, Minimized Costs
Designed to accommodate 150 mm wafers (CPS150) and 200 mm wafers (CPS200), these probe stages increase testing throughput while reducing the testing cost per qubit.
Precision Motion & Contact Control
Both models offer high-precision Tx-Ty-Tz positioning and Rz alignment, ensuring accurate probe placement. The integrated probe card interface guarantees stability during probing. Additionally, the CPS150 is designed to eliminate power dissipation during probing.
For cutting-edge quantum chip probing at cryogenic temperatures, the CPS150 and CPS200 set the new standard for scalability, flexibility and cost efficiency.
Datasheets and application notes
Timeline CPS150
